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Asrock Intel B860 Express Lga1851 Atx Memory Ddr5 Memory Slots 4 1Xpci-Express 4.0 16X 1Xpci-Express 5.0 16X 1Xm.2 1Xhdmi 1Xdisplayport 1Xaudio-In 1Xaudio-Out 1Xmicrophone 2Xusb 2.0 6Xusb 3.2 1Xusb-C 1Xrj45 B860Pro-Awifi

Mainboard ASROCK Intel B860 Express LGA1851 ATX Memory DDR5 Memory slots 4 1xPCI-Express 4.0 16x 1xPCI-Express 5.0 16x 1xM.2 1xHDMI 1xDisplayPort 1xAudio-In 1xAudio-Out 1xMicrophone 2xUSB 2.0 6xUSB 3.2 1xUSB-C 1xRJ45 B860PRO-AWIFI

132.00 

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Kiekis: Liko 0
SKU:1433288

Pro-A series is designed for enhanced stability, durability, and efficiency, it offers reliable performance, user-friendly features and a streamlined aesthetic, making it ideal for daily computing needs.

Hi-Density Power Connector
CPU overclocking requires higher current. ASRock Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power connectors, providing a more stable system and reducing the risk of fire during heavy overclocking.

10+1+1 Power Phase Design
Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.

Dr. MOS
Dr.MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Compared to traditional discrete MOSFETs, it intelligently delivers higher current for each phase, thus providing improved thermal result and superior performance.

DDR5 XMP & EXPO Support
Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboard is built with high quality materials, enthusiasts are able to enjoy the boost of DDR5 memory overclocking performance by enabling the pre-tested profiles. Make sure the memory modules are Intel® XMP/AMD EXPO™ capable and overclocking can be made so affordable, satisfying and absolutely no sweat at all.

PCIe Gen5 Blazing M.2
The Blazing M.2 accommodates the latest PCI Express 5.0 standard to perform twice the bandwidth compared to previous generation, with a breathtaking 128Gb/s transfer speed, it is ready to unleash the full potential of future ultrafast SSDs.

Aluminum Heatsink
The first thing that catches the eye is the optimized Aluminum Heatsink Design. Heatsinks are crucial for efficient heat dissipation, especially during heavy workloads like gaming or productivity tasks. Motherboard that built with heatsinks can effectively manage thermal performance, hence ensure system stability and durability effortlessly.

Wi-Fi 6E 802.11axe
WiFi 6E technology has extended to the whole new 6GHz spectrum band, providing more WiFi capability and giving an even better and faster internet traffic. In addition to deliver higher speeds, the WiFi 6E also enhances the lower latency and supports service levels that are equivalent to 5G networks.

Dragon 2.5 Gb/s LAN
The intelligent 2.5Gb/s LAN platform is built for maximum networking performance for the demanding requirements of home networking, content creators, online gamers and high-quality streaming media. Boost networking performance up to 2.5X the bandwidth compared to the standard gigabit Ethernet, you’ll enjoy the faster and uncompromised connectivity experience for gaming, file transfers and backups.

POLYCHROME RGB
This motherboard features onboard RGB headers and addressable RGB headers that allow motherboard to be connected to compatible LED devices such as strip, CPU fans, coolers, chassis and so on. Users may also synchronize RGB LED devices across the Polychrome RGB Sync-certified accessories to create their own unique lighting effects.

Asrock B860 Pro-A WiFi. Processor manufacturer: Intel, Processor socket: LGA 1851 (Socket V1). Supported memory types: DDR5-SDRAM, Maximum internal memory: 256 GB, Memory slots type: DIMM. Supported storage drive interfaces: M.2, SATA III, RAID levels: 0, 1, 5, 10. Graphics card family: Intel. Ethernet interface type: 2.5 Gigabit Ethernet, LAN controller: Dragon RTL8125BG, Top Wi-Fi standard: Wi-Fi 6E (802.11ax)

Specifikacijos

Vendor Homepagehttps://asrock.com/MB/Intel/B860%20Pro-A%20WiFi/index.asp#Overview
Category CodeMBI
Unit Box Height0.075
Unit Box Length0.355
Unit Box Width0.28
Audio chipRealtek ALC897
Audio output channels7.1 channels
Component forPC
Motherboard chipsetIntel B860
Motherboard chipset familyIntel
Motherboard form factorATX
Windows operating systems supportedWindows 11 x64
Processor manufacturerIntel
Processor socketLGA 1851 (Socket V1)
ECC сompatibilityNon-ECC
Maximum internal memory256 GB
Memory channelsDual-channel
Memory slots typeDIMM
Number of memory slots4
Supported memory typesDDR5-SDRAM
Unbuffered memoryYes
RAID levels0/1/10/5
RAID supportYes
Supported storage drive interfacesM.2,SATA III
Graphics card familyIntel
On-board graphics cardYes
CPU fan connectorYes
Front panel audio connectorYes
Number of chassis fan connectors4
Number of CPU fan connectors2
Number of SATA III connectors4
RGB LED pin headerYes
TPM connectorYes
USB 2.0 connectors2
USB 3.2 Gen 1 (3.1 Gen 1) connectors2
DisplayPort version1.4
DisplayPorts quantity1
Ethernet LAN (RJ-45) ports1
HDMI ports quantity1
Line-inYes
Microphone inYes
USB 2.0 ports quantity2
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity6
USB 3.2 Gen 2x2 Type-C ports quantity1
BluetoothYes
Bluetooth version5.3
Ethernet interface type2.5 Gigabit Ethernet
Ethernet LANYes
LAN controllerDragon RTL8125BG
Top Wi-Fi standardWi-Fi 6E (802.11ax)
Wi-FiYes
Wi-Fi standards802.11a/802.11b/802.11g/Wi-Fi 4 (802.11n)/Wi-Fi 5 (802.11ac)/Wi-Fi 6 (802.11ax)/Wi-Fi 6E (802.11ax)
Number of M.2 (M) slots1
PCI Express x16 (Gen 4.x) slots1
PCI Express x16 (Gen 5.x) slots1
BIOS memory size256 Mbit
BIOS typeUEFI AMI
Depth244 mm
Width305 mm
Cables includedSATA
ModelB860 Pro-A WiFi
Units per Shipping Box5
Unit Calculated Volume0.008784 cubm
Unit Calculated Weight1.82 kg
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