Your notebook or small-form-factor machine can now experience the latest, cutting-edge memory technology with Kingston FURY™ Impact DDR5. With Intel® XMP 3.0 Certified SODIMM kit capacities of up to 64GB, Kingston FURY Impact DDR5 packs all the enhanced features of DDR5 into a slim, compact form factor. On Plug N Play* enabled modules, Kingston FURY Impact DDR5 automatically overclocks, giving your system a boost in performance without having to enable a profile. Modules featuring XMP 3.0 profiles can overclock to the highest frequency published, up to 6400MT/s, by selecting the profile in BIOS settings.
Mighty DDR5 SODIMM performance
With a starting speed of 4800MT/s, DDR5 is 50% faster than DDR4 for a boost in gaming, rendering, and multitasking.
Plug N Play automatic overclocking functionality*
Kingston FURY Impact DDR5’s PnP modules automatically overclock to the highest listed speed.
Intel® XMP 3.0 Certified
Maximise memory performance with advanced pre-optimised timings, speed and voltage for overclocking.
Low Power Consumption, Increased efficiency
Keep your system cool and efficient with Kingston FURY Impact DDR5’s low power draw.
Improved stability with on-die ECC
Maintain data integrity while hitting overclocking speeds.
- Mighty DDR5 SODIMM performance
- Plug N Play automatic overclocking functionality**
- Intel® XMP 3.0 Certified
- Low power consumption, increased efficiency
- Improved stability with on-die ECC
* Kingston FURY Plug N Play memory will run in DDR5 systems up to the speed allowed by the manufacturer’s system BIOS. PnP cannot increase the system memory speed faster than is allowed by the manufacturer’s BIOS. Kingston FURY Plug N Play DDR5 products support XMP 3.0 specifications so overclocking can also be achieved by enabling the built-in XMP Profile. PnP is only featured on 4800MT/s and 5600MT/s speed modules.
Specifikacijos
| Vendor Homepage | https://www.kingston.com/unitedkingdom/en/memory/gaming/kingston-fury-impact-ddr5-memory |
|---|---|
| Category Code | MEB |
| Unit Box Height | 0.06 |
| Unit Box Length | 0.17 |
| Unit Box Width | 0.015 |
| Buffered memory type | Unregistered (unbuffered) |
| CAS latency | 38 |
| Component for | Laptop |
| Cooling type | Heatsink |
| Country of origin | China/Taiwan |
| ECC | No |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Internal memory | 32 GB |
| JEDEC standard | Yes |
| Lead plating | Gold |
| Memory data transfer rate | 4800 MT/s |
| Memory form factor | 262-pin SO-DIMM |
| Memory layout (modules x size) | 1 x 32 GB |
| Memory ranking | 2 |
| Memory voltage | 1.1 V |
| Module configuration | 4096M x 64 |
| On-Die ECC | Yes |
| Programming power voltage (VPP) | 1.8 V |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Row cycle time | 48 ns |
| SPD profile | Yes |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 10 g |
| Width | 3.8 mm |
| Package depth | 13.97 mm |
| Package height | 171.45 mm |
| Package weight | 26.72 g |
| Package width | 57.15 mm |
| Master (outer) case gross weight | 812.13 g |
| Master (outer) case height | 60.96 mm |
| Master (outer) case length | 311.15 mm |
| Master (outer) case width | 196.85 mm |
| Products per master (outer) case | 25 pc(s) |
| Units per Shipping Box | 1 |
| Unit Calculated Volume | 0.000153 cubm |
| Unit Calculated Weight | 0.031 kg |